- ultra thin profile quad flat package
The New English-Russian Dictionary of Radio-electronics. F.V Lisovsky . 2005.
The New English-Russian Dictionary of Radio-electronics. F.V Lisovsky . 2005.
Quad-flat no-leads package — 28 pin QFN, upside down to show contacts and thermal/ground pad Flat no leads packages such as QFN (quad flat no leads) and DFN (dual flat no leads) physically and electrically connect integrated circuits to printed circuit boards. Flat no leads … Wikipedia
Chip carrier — A standard sized 8 pin dual in line package (DIP) containing a 555 timer IC. A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or… … Wikipedia
Типы корпусов микросхем — Ранняя советская микросхема К1ЖГ453 Корпус интегральной микросхемы (ИМС) это герметичная несущая система и часть конструкции, предназначенная для защиты кристалла (кремниевой подложки с нанесёнными на неё элементами) интегральной схемы от внешних … Википедия
List of computing and IT abbreviations — This is a list of computing and IT acronyms and abbreviations. Contents: 0–9 A B C D E F G H I J K L M N O P Q R S T U V W X Y … Wikipedia
Ball grid array — For other uses, see BGA (disambiguation). Intel Embedded Pentium MMX (bottom view) A ball grid array (BGA) is a type of surface mount packaging used for integrated circuits. Contents … Wikipedia
Business and Industry Review — ▪ 1999 Introduction Overview Annual Average Rates of Growth of Manufacturing Output, 1980 97, Table Pattern of Output, 1994 97, Table Index Numbers of Production, Employment, and Productivity in Manufacturing Industries, Table (For Annual… … Universalium